In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip mounted or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.
p-i-n Photodiodes - Chip on Carrier
Product | Speed | Channels | Carrier Type | Details |
---|---|---|---|---|
PS40X1 | 56 Gbd | 1 | ceramic submount | Read More |
PS40X4 | 56 Gbd | multiple | ceramic submount | Read More |
PS20Y4-2C | 28 Gbd | 4 | ceramic submount | Read More |
PS50X1 | 112 Gbd | 1 | ceramic submount | Read More |
PS60X1 | 112 Gbd | 1 | ceramic submount | Read More |
PS60X4 | 112 Gbd | multiple | ceramic submount | Read More |
PS20X1 | 28 Gbd | 1 | ceramic submount | Read More |
PS20Xn | 28 Gbd | multiple | ceramic submount | Read More |
PS05F1 | 10 Gb/s | 1 | wrap-around submount | Read More |
PS05J4 | 2.5 Gb/s | 4 | wrap-around submount | Read More |
PS05J8 | 2.5 Gb/s | 8 | wrap-around submount | Read More |
PS00L1 | DC | 1 | wrap-around submount | Read More |
APD - Chip on Carrier
Product | Speed | Channels | Carrier Type | Details |
---|---|---|---|---|
APS20D1 | 28 Gbd | 1 | ceramic submount | Read More |
APS20B1/C1 | 25 Gb/s | 1 | ceramic submount | Read More |
APS10D1 | 10 Gb/s | 1 | ceramic submount | Read More |
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