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Moosstrasse 2a
8803 Rueschlikon, Switzerland

In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip mounted or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.

p-i-n Photodiodes - Chip on Carrier

ProductSpeedChannelsCarrier TypeDetails
PS00L11 Gb/s1wrap-around submountRead More
PS05F110 Gb/s1wrap-around submountRead More
PS05J162.5 Gb/s16wrap-around submountRead More
PS05J42.5 Gb/s4wrap-around submountRead More
PS05J82.5 Gb/s8wrap-around submountRead More
PS20X128 Gbd1ceramic submountRead More
PS20Xn28 Gbdmultipleceramic submountRead More
PS20Y428 Gbd4ceramic submountRead More
PS40X156 Gbd1ceramic submountRead More
PS40X456 Gbdmultipleceramic submountRead More
PS50X1112 Gbd1ceramic submountRead More
PS60X1112 Gbd1ceramic submountRead More
PS60X4112 Gbdmultipleceramic submountRead More
PS70X1128 Gbd1ceramic submountRead More

APD - Chip on Carrier

ProductSpeedChannelsCarrier TypeDetails
APS10D110 Gb/s1ceramic submountRead More
APS20B1/C125 Gb/s1ceramic submountRead More
APS20D128 Gbd1ceramic submountRead More