How is the metallization of photodiode pads constructed ?
The pads on Albis photodiode chips are built from a stack of different metals. On the chip front-side we offer two different stacks. The first stack alternative is optimized for wire-bonding. It consists of an adhesion layer followed by 1.3 µm of pure gold. The second alternative is optimized for soldering. Again it consists of […]Read More
5 Gb/s GaAs Photodiode
Top-illuminated photodiode chip designed for coupling with 50/125 or 62/125 multimode fibers used in short-wavelength 5 Gb/s datacom applications.Read More
12 Gb/s Photodiode
Top illuminated photodiode chip for single-mode data and telecom applications up to 12.7 Gb/s.Read More
12 Gb/s Long Wavelength Photodiode
Top illuminated photodiode chip for single-mode data and telecom applications up to 12 Gb/s.Read More