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PD05J4 on wrap-around Carrier
4 Channel Flip-chip Soldered Monitoring Photodiode Array


Monolithic array of four InGaAs/InP bottom illuminated photodiode chips with large optical apertures separated by a standard 250 μm pitch. The bottom illuminated p-i-n photodiode structures are optimized for low speed monitoring applications in data- and telecom up to 2.5 Gb/s. They offer an excellent responsivity and high speed of response in the wavelength region from 1260 to 1620 nm.
The bottom-illuminated 4 channel photodiode array is flip-chip soldered on a ceramic submount with wrap-around metallization.


  • Optimized for laser monitoring
  • Easy optical coupling into large backside optical aperture
  • High responsivity: 0.9 A/W
  • Assembly on spacer, wrap-around carrier etc.
  • Customized carrier layouts

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