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A European research and industry consortium led by Soitec, a world leader in the design and manufacture of innovative semiconductor materials, has begun work to develop a future generation of high-frequency semiconductors based on Indium Phosphide (InP).

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ARCTIC – Advanced Research on Cryogenic Technologies for Innovative Computing

New Chips Joint Undertaking research project ARCTIC is addressing cryogenic classical and quantum microsystems. Albis Optoelectronics will contribute to this project with developing high-power photodiodes for ultra-low phase noise microwave generation at cryogenic temperatures.

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PM Series – The new product line of photodiode modules

Albis Optoelectronics recently introduced the PM Series – its new photodiode module product line. The PM modules are a series of self-contained, ready-to-use, high-speed photodiode modules for direct optical-to-electrical conversion of RF-modulated optical signals. All modules are LiPo battery powered and USB-C chargeable.

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RETINA – Four-quadrant InGaAs avalanche photodiodes for LEO direct-to-Earth optical ground station

Albis Optoelectronics announces the launch of RETINA – Four-quadrant InGaAs avalanche photodiodes for LEO direct-to-Earth optical ground station, an ESA funded R&D project that started in May 2023 under the framework of the ScyLight programme.

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Albis Optoelectronics and HiLight Semiconductor demonstrate a high performance, cost effective receiver solution for 10G-PON ONUs

Albis and HiLight are promoting their latest 10G APD and CMOS TIA-receiver products by jointly demonstrating high levels of performance achieved with this unique APD-TIA combination.

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2023 Lightwave Innovation Award for Albis Optoelectronics

The microwave photodetector PQS40A-L receives prestigious 2023 Lightwave Innovation Award.

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New 40 GHz Photodetector

At the upcoming ECOC 2022 exhibition in Basel, Albis Optoelectronics will present its new 40 GHz photodetector PQS40A-L, a small sized packaged device, designed for the detection of RF-modulated optical signals.

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BAROC – Bandpass RF O/E Converter

The project focuses on the development of a new packaged RF photodetector with optimized form factor and integration of a monolithic microwave integrated circuit (MMIC) for broadband matching from 0 to 40 GHz and narrowband matching for frequencies inside 2 to 4 GHz and 22 to 26 GHz.

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Albis Optoelectronics honored by 2022 Lightwave Innovation Reviews

Albis Optoelectronics announced today that both its entries, the 28 Gbaud avalanche photodiode APD20D1 and the 800G photodiode array PS60X4, were recognized among the best by the 2022 Lightwave Innovation Reviews.

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Being an EPIC Member

We are delighted to announce that we are now a member of EPIC – the world leading photonics industry association!

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New 28 Gbd Avalanche Photodiode (APD) with high optical damage threshold

At the upcoming virtual OFC exhibition Albis will present its new, topside illuminated 28 Gbd APD chip APD20E1.
Key features of this innovative APD are a large dynamic range and a high optical damage threshold of up to +5 dBm.

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ECOC 2020 – Featured Products

ECOC Exhibition 2020 is the first time ever for Albis to participate in a virtual event. Come and visit us at www.ecoclive.com and find out about our latest product releases such as our PS60X1, a 112 Gbaud/s high speed photodiode assembly targeting 800G transmission links. We look forward to shake hands virtually!

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SIPhoDiAS – Photonic Very High-Throughput Satellites

The European R&D project “SIPhoDiAS” aims at developing space photonic components and sub-systems for the new telecom satellite generation.

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New Photodiodes for Long-Wavelength LiDAR

New highly sensitive APD chip APD05C1. This linear mode APD is optimized for long-wavelength, eye safe LiDAR applications and comes with low dark current and low excess noise.

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APPLAUSE – an ECSEL Joint Undertaking project – focuses on developing advanced packaging for photonics, optics and electronics for low cost manufacturing

A consortium of 31 European electronics packaging, optics and photonics key players, leading equipment suppliers and testing experts launched a new project, β€œAdvanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE. The project fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing. The 34M€ total budget for the three-year project is co-funded by Horizon 2020 and national funding agencies and industries, as a part of the Electronics Components and Systems for European Leadership Joint Undertaking (ECSEL JU).

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