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Moosstrasse 2a
8803 Rueschlikon, Switzerland

In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.

Chip on Carrier

ProductSpeedChannelsIlluminationDetails
APS20B125 Gb/s1LensRead More
PS20X128 Gb/s1LensRead More
PS20Xn28 Gb/snLensRead More
PS05F110 Gb/s1TopRead More
PS05J42.5 Gb/s4BottomRead More