In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.
Chip on Carrier
|APS20B1||25 Gb/s||1||Lens||Read More|
|PS20X1||28 Gb/s||1||Lens||Read More|
|PS20Xn||28 Gb/s||n||Lens||Read More|
|PS05F1||10 Gb/s||1||Top||Read More|
|PS05J4||2.5 Gb/s||4||Bottom||Read More|