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Moosstrasse 2a
8803 Rueschlikon, Switzerland

In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers.

Chip on Carrier

Product NameSpeedActive DiameterIlluminationDetails
APS20B125 Gb/s16LensRead More
PS05F110 Gb/s60TopRead More
PS05J42.5 Gb/s120BottomRead More
PS20X128 Gb/s24LensRead More
PS20Xn28 Gb/s24LensRead More