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Albis Optoelectronics extends portfolio of mounted photodiodes

In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customized 2D or 3D (wrap-around) carriers. For example, PS20X4 consists of an array of four, flip-chip soldered 28 Gbps lensed photodiodes that can be used as the core building block inside a 100G ROSA module. As multiple customization projects are currently being worked on, the company is expanding work force and production infrastructure to support an increasing demand.

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